Empowering Open Networking: Accelerating Commercial SONiC Deployment Based on Centec Chip

  • Flexible Port Configurations: From 10G/25G/40G/100G/200G/400G/800G aggregation, with multiple port density options.
  • Enterprise-Grade Reliability: Redundant power supplies, hot-swappable fans, and comprehensive hardware monitoring.
  • Commercial-Ready SONiC Reference System: Based on a stable community release, with integrated drivers, peripheral control, and platform monitoring.
  • Out-of-the-Box Deployment: Source code compiles and runs directly on target hardware, with full control-plane and data-plane integration.

Application Scenarios:

  1. Data Center
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Description

SONIC ECOSYSTEM Overview
1. Industry Background: The Inevitable Shift from Closed to Open Networking

With the rapid growth of cloud computing, large-scale AI models, and edge computing, traditional “black-box” switches—with their closed software ecosystems—have increasingly become a bottleneck for rapid deployment and flexible scaling.

SONiC (Software for Open Networking in the Cloud), as a globally leading open-source network operating system, has become a core foundation for next-generation data center networks due to its disaggregated architecture, modular design, and high scalability.

However, transforming open-source SONiC into a stable, commercially deployable solution remains challenging. Hardware adaptation complexity, SAI (Switch Abstraction Interface) integration difficulties, and long development cycles continue to be major obstacles.

2. Solution Overview: A Dual-Engine Model of Hardware Platform + Reference System Source Code

Leveraging years of deep expertise in switch R&D, we introduce an integrated solution combining a Centec chip–based hardware platform with a SONiC reference system design.

Rather than simply selling hardware, we deliver a “ready-to-run” development foundation. By abstracting the complexity of the underlying hardware, development teams can bypass low-level adaptation and focus on higher-layer business logic and value-added features—significantly shortening time-to-market.

3. Core Components of the Solution
    *High-Performance Hardware Platform (Based on Centec chip)

Powered by high-performance Centec chip, delivering high bandwidth, low latency, and strong forwarding capability.

A broad range of switch hardware options, from 1G/10G/25G access to 100G/400G aggregation, supporting multiple port density configurations.

Optimized for enterprise and data center environments, featuring redundant power supplies, hot-swappable fans, and comprehensive hardware monitoring.

    *Deeply Adapted SONiC Reference System

Based on a stable community SONiC release, the delivered source code includes integrated drivers, peripheral control (LED / SFP / Fan / PSU), and platform monitoring modules.

The source code can be compiled and run directly on target hardware, ensuring full control-plane and data-plane integration.

4. Core Value

Our solution eliminates from-scratch development risks by completing approximately 80% of platform and SAI adaptation work.

Customers gain full software-hardware decoupling and deep customization capabilities, including protocol enhancement, management integration, branded UI/UX, and long-term technical support.

5. Customer Development Journey

*Hardware adoption
*Code delivery
*Secondary development

6. Hardware Platforms

For detailed hardware models, please refer to the hardware appendix.

7. Conclusion

With Centec-based hardware and a commercial-ready SONiC reference system, customers can accelerate development, reduce cost, and gain a competitive edge in open networking.

SONIC Switch Model

Model Specification Chip CPU SONiC Version SAI Version
S9532-EI 32*800G OSFP, 2U
Power Supply: 2*CRPS 3200WAC input
Fan Module: 4*Hot-swappable modules
AIR-Flow: Front-to-Back
CTC9280 Intel Xeon D-1627 SONiC.202311 SAI1.13.3
S8564-EI 64*400G QSFP112
Power Supply: 2*CRPS 3200WAC input
Fan Module: 4*Hot-swappable modules
AIR-Flow: Front-to-Back
CTC9280
S8532-EI 32*400G QSFP112
Power Supply: 2*CRPS 1300WAC inputFan Module: 6*Hot-swappable modulesAIR-Flow: Front-to-Back
CTC9260
S8264-EI 64*400G QSFP112
Power Supply: 2*CRPS 3200WAC input
Fan Module: 4*Hot-swappable modules
AIR-Flow: Front-to-Back
CTC9282
S8232-2X 32 * 200G QSFP56, 2 * 10G SFP+
Power Supply: 2*Hot-swappable
Fan Module: Hot-swappable Fan ModulesAIR-flow: Front-to-back
CTC8290
S8224-6D 24 * 200G QSFP56, 6*400G QSFP-DD
Power Supply: 2*Hot-swappable
Fan Module: Hot-swappable Fan ModulesAIR-flow: Front-to-back
CTC9262
S7832Z-EI 32*100G QSFP28
Power Supply: 2*CRPS 550WAC input
Fan Module: 4*Hot-swappable modules
AIR-Flow: Front-to-Back
CTC8180
S7814ZH-4N-EI 14*100G QSFP28, 4*25G/10G SFP28, 1/2U
Power Supply: 2*CRPS 300WAC input
Fan Module: 2*Hot-swappable modules
AIR-flow: Front-to-back
CTC8126
S7648-8B 48 * 50G QSFP56, 8 * 200G QSFP56
Power Supply: 2*Hot-swappable
Fan Module: Hot-swappable Fan ModulesAIR-flow: Front-to-back
CTC8290
S7524N-8Z-EI 24*10G/25G SFP28, 8*100G QSFP28
Power Supply: 2*CRPS 350WAC input
Fan Module: 2*Hot-swappable modules
AIR-Flow: Front-to-Back
CTC8126
S7548N-8Z-EI 48*10G/25G SFP28, 8*100G QSFP28
Power Supply: 2*CRPS 550WAC input
Fan Module: 5*Hot-swappable modules
AIR-Flow: Front-to-Back
CTC8180
S7548N-4Z-EI 48*25G SFP28, 4*100G QSFP28
Power Supply: 2*CRPS 550WAC input
Fan Module: 4*Hot-swappable module
AIR-flow: Front-to-rear
CTC8126
S5748X-8Z-EI 48*10G SFP+, 8*100G QSFP28
Power Supply: 2*CRPS 550WAC input
Fan Module: 4*Hot-swappable modules
AIR-Flow: Front-to-Back
CTC8148
S5748X-8Z-SI 48*10G SFP+, 8*100G QSFP28
Power Supply: 1*200W Fixed Power Supply
Fan: 4*Fixed Fan
AIR-Flow: Front-to-Back
CTC8148
S5724X-8Z-EI 24*10G SFP+, 8*100G QSFP28
Power Supply: 2*CRPS 350WAC input
Fan Module: 4*Hot-swappable modules
AIR-Flow: Front-to-Back
CTC8148
S5724X-8Z-SI 24*10G SFP+, 8*100G QSFP28
Power Supply: 1*200W Fixed Power Supply
Fan: 4*Fixed Fan
AIR-Flow: Front-to-Back
CTC8148
S5648T-8Z-EI 48*100M/1G/2.5G/5G/10G Base-T, 8*100G QSFP28
Power Supply: 2*CRPS 550WAC input
Fan Module: 4*Hot-swappable modules
AIR-flow: Front-to-back
CTC8180