Empowering Open Networking: Accelerating Commercial SONiC Deployment Based on Centec Chip

  • Flexible Port Configurations: From 10G/25G/40G/100G/200G/400G/800G aggregation, with multiple port density options.
  • Enterprise-Grade Reliability: Redundant power supplies, hot-swappable fans, and comprehensive hardware monitoring.
  • Commercial-Ready SONiC Reference System: Based on a stable community release, with integrated drivers, peripheral control, and platform monitoring.
  • Out-of-the-Box Deployment: Source code compiles and runs directly on target hardware, with full control-plane and data-plane integration.

Application Scenarios:

  1. Data Center
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Description

I. Industry Background: The Inevitable Trend from Closed to Open

With the explosive growth of cloud computing, AI big data models, and edge computing, traditional “black box” switches, due to their closed software ecosystem, are gradually becoming a bottleneck for enterprises’ rapid deployment and flexible expansion. SONiC (Software for Open Networking in the Cloud), as a leading global open-source network operating system, has become the core of building next-generation data center networks due to its decoupling, modularity, and high scalability. However, transforming open-source SONiC into a stable, commercially viable product still faces significant challenges, including difficulties in hardware adaptation, complex SAI (Switching Abstraction Interface) layer debugging, and long R&D cycles.

II. Solution Overview: A “Dual-Engine” Model of Hardware Platform + Barebone System Source Code

Based on our years of deep experience in switch R&D, our company has launched an integrated solution of “Shengke Chip Hardware Platform + SONiC Barebone System Reference Design.” We are not just selling hardware, but providing you with a “delivery-ready” R&D foundation. By shielding the underlying hardware complexity, your R&D team can skip the tedious low-level adaptation and directly enter the development of upper-layer business logic and value-added functions, significantly shortening the time-to-market (TTO) time.

III. Core Components of the Solution

1. High-Performance Hardware Platform (Based on Centec Chips)

*Domestic Chip Power: Utilizes high-performance switching chips from Centec, featuring high bandwidth, low latency, and strong forwarding capabilities, meeting the strategic needs of domestic substitution and independent control.

*Diverse Specifications: Provides core switch hardware ranging from 1G/10G/25G access to 100G/400G aggregation, supporting various port density combinations.

*High Reliability Design: Optimized for enterprise/data center applications, supporting redundant power supplies, hot-swappable fans, and comprehensive monitoring sensor integration.

2. Deeply Adapted SONiC Reference System

*Integrated Basic Functions: Provides source code based on a stable community-based version, with built-in, complete drivers, peripheral control (LED/SFP/Fan/PSU), and platform monitoring modules.

*Out-of-the-Box Experience: The source code delivered to customers can be directly compiled and run on the corresponding hardware, ensuring complete connectivity between the management and data planes.

IV. Core Value: Why Choose Our Reference Solution?

1. Avoiding the Risk of “Starting from Scratch”: Adapting the underlying hardware drivers (Platform API) and SAI layer is the most time-consuming and risky part of SONiC development. We handle 80% of this tedious work for you, allowing you to avoid various pitfalls that may arise when combining open-source community code with specific hardware.

2. Achieving True Software-Hardware Decoupling and Customization

Unlike traditional OEM/ODM solutions, we provide a reference source code for a reference system. This means:

* Protocol Customization: You can freely add optimizations for advanced protocols such as BGP, EVPN, and VxLAN.

* Enhanced Management: Easily integrate your own CLI, SNMP, gNMI, or self-developed telemetry systems.

* Brand Rebranding: Customers can deeply customize the UI/UX to create a NOS system with a completely unique brand visual identity.

* Technical Support: Continuously provide customers with follow-up SAI upgrade services or related technical consultation.

V. Customer Development Path

* Hardware Import: Purchase our mature Shengke chip switch hardware.

* Code Delivery: Obtain the corresponding SONiC barebone system source code and detailed adaptation documentation.

* Secondary Development: Develop customer-specific features or integrate existing software assets based on the reference source code.

VI. Hardware Platform

Please refer to the attached “Hardware Models” for relevant switch hardware models.

VII. Conclusion

In this era where speed determines success or failure, there’s no need to reinvent the wheel. With the Shengke hardware and SONiC barebone system provided by our company, you will gain a high-starting-point R&D platform. We will help you gain a competitive edge in the blue ocean of open networks at a lower cost and in a shorter time.

SONIC Switch Model

Model Specification Chip CPU SONiC Version SAI Version
S9532-EI 32*800G OSFP, 2U
Power Supply: 2*CRPS 3200WAC input
Fan Module: 4*Hot-swappable modules
AIR-Flow: Front-to-Back
CTC9280 Intel Xeon D-1627 SONiC.202311 SAI1.13.3
S8564-EI 64*400G QSFP112
Power Supply: 2*CRPS 3200WAC input
Fan Module: 4*Hot-swappable modules
AIR-Flow: Front-to-Back
CTC9280
S8532-EI 32*400G QSFP112
Power Supply: 2*CRPS 1300WAC input
Fan Module: 6*Hot-swappable modulesAIR-Flow: Front-to-Back
CTC9260
S8264-EI 64*400G QSFP112
Power Supply: 2*CRPS 3200WAC input
Fan Module: 4*Hot-swappable modules
AIR-Flow: Front-to-Back
CTC9282
S8232-2X 32 * 200G QSFP56, 2 * 10G SFP+
Power Supply: 2*Hot-swappable
Fan Module: Hot-swappable Fan ModulesAIR-flow: Front-to-back
CTC8290
S8224-6D 24 * 200G QSFP56, 6*400G QSFP-DD
Power Supply: 2*Hot-swappable
Fan Module: Hot-swappable Fan ModulesAIR-flow: Front-to-back
CTC9262
S7832Z-EI 32*100G QSFP28
Power Supply: 2*CRPS 550WAC input
Fan Module: 4*Hot-swappable modules
AIR-Flow: Front-to-Back
CTC8180
S7814ZH-4N-EI 14*100G QSFP28, 4*25G/10G SFP28, 1/2U
Power Supply: 2*CRPS 300WAC input
Fan Module: 2*Hot-swappable modules
AIR-flow: Front-to-back
CTC8126
S7648-8B 48 * 50G QSFP56, 8 * 200G QSFP56
Power Supply: 2*Hot-swappable
Fan Module: Hot-swappable Fan ModulesAIR-flow: Front-to-back
CTC8290
S7524N-8Z-EI 24*10G/25G SFP28, 8*100G QSFP28
Power Supply: 2*CRPS 350WAC input
Fan Module: 2*Hot-swappable modules
AIR-Flow: Front-to-Back
CTC8126
S7548N-8Z-EI 48*10G/25G SFP28, 8*100G QSFP28
Power Supply: 2*CRPS 550WAC input
Fan Module: 5*Hot-swappable modules
AIR-Flow: Front-to-Back
CTC8180
S7548N-4Z-EI 48*25G SFP28, 4*100G QSFP28
Power Supply: 2*CRPS 550WAC input
Fan Module: 4*Hot-swappable module
AIR-flow: Front-to-rear
CTC8126
S5748X-8Z-EI 48*10G SFP+, 8*100G QSFP28
Power Supply: 2*CRPS 550WAC input
Fan Module: 4*Hot-swappable modules
AIR-Flow: Front-to-Back
CTC8148
S5748X-8Z-SI 48*10G SFP+, 8*100G QSFP28
Power Supply: 1*200W Fixed Power Supply
Fan: 4*Fixed Fan
AIR-Flow: Front-to-Back
CTC8148
S5724X-8Z-EI 24*10G SFP+, 8*100G QSFP28
Power Supply: 2*CRPS 350WAC input
Fan Module: 4*Hot-swappable modules
AIR-Flow: Front-to-Back
CTC8148
S5724X-8Z-SI 24*10G SFP+, 8*100G QSFP28
Power Supply: 1*200W Fixed Power Supply
Fan: 4*Fixed Fan
AIR-Flow: Front-to-Back
CTC8148
S5648T-8Z-EI 48*100M/1G/2.5G/5G/10G Base-T, 8*100G QSFP28
Power Supply: 2*CRPS 550WAC input
Fan Module: 4*Hot-swappable modules
AIR-flow: Front-to-back
CTC8180